The Editorial Board of Engineering Education Review (EER) is pleased to announce the appointment of Professor Seeram Ramakrishna as a new Editorial Board Member.

Professor Ramakrishna is a Chair Professor and Xinghua Distinguished Chair Professor in the Department of Mechanical Engineering at Tsinghua University, where he also serves as Director of the iWearables Center. He was a member of the faculty at the National University of Singapore (NUS) from 1996 to 2025, holding senior academic leadership positions including Vice President (Research Strategy) and Dean of Engineering.

In 2023, Professor Ramakrishna was elected a foreign member of the Chinese Academy of Engineering. He is also a Fellow of the Royal Academy of Engineering (FREng) in the United Kingdom and has affiliations with the Singapore Academy of Engineering and the Indian National Academy of Engineering. He was a co-founder of the Global Engineering Deans Council (GEDC).

His research focuses on electrospun nanofibers, advanced materials, nanotechnology, and intelligent wearable systems. His appointment will further strengthen EER’s interdisciplinary expertise and international connections across engineering research, higher education, and global collaboration.

       Prof. Seeram Ramakrishna

Chair Professor and Xinghua Distinguished Chair Professor, Department of Mechanical Engineering, Tsinghua University

Director, iWearables Center, Tsinghua University

Foreign Member, Chinese Academy of Engineering

Fellow, Royal Academy of Engineering (FREng), United Kingdom

Research areas:

electrospun nanofibers, advanced materials, nanotechnology, and intelligent wearable systems.